Patent Assignment
Reel/Frame 024987/0383
Assignment of Assignor's Interest
Recorded: 2010-09-14
Pages: 3
Assignors
SELLI, GUISEPPE
Executed: 2010-09-09
DEVITA, MICHAEL
Executed: 2010-09-13
KUO, BOB SHIH-WEI
Executed: 2010-09-10
Assignee
AMKOR TECHNOLOGY, INC.
1900 SOUTH PRICE RD., CHANDLER, ARIZONA, 85248
Covered Property
(1)
Conductive Paste and Mold for Electrical Connection of Photovoltaic Die to Substrate
Patent:
8,552,517 →
Application:
12/881,905 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement
May 7, 2015
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 035613/0592 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →