IP Library › Assignment 025037/0162
Patent Assignment
Reel/Frame 025037/0162

Assignment of Assignor's Interest

Recorded: 2010-09-24 Pages: 3
Assignors
SU, MICHAEL Z.
Executed: 2010-09-22
BLACK, BRYAN
Executed: 2010-09-22
Assignee
ADVANCED MICRO DEVICES, INC.
ONE AMD PLACE, PO BOX 3453, KEVIN A. O'NEIL, SUNNYVALE, CALIFORNIA, 94088-3453
Covered Property (1)
Semiconductor Chip with Reinforcing Through-Silicon-Vias
Patent: 8,193,039 →
Application: 12/889,615 →
Publication: US 2012/0074579
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 24, 2010
From: REFAI-AHMED, GAMAL
To: ATI TECHNOLOGIES ULC
Reel/Frame 025037/0104 →
Assignment of Assignor's Interest Nov 15, 2024
From: ATI TECHNOLOGIES ULC
To: ONESTA IP, LLC
Reel/Frame 069379/0556 →
Assignment of Assignor's Interest Apr 22, 2025
From: ADVANCED MICRO DEVICES INC.
To: ONESTA IP, LLC
Reel/Frame 070909/0934 →