IP Library › Assignment 070909/0934
Patent Assignment
Reel/Frame 070909/0934

Assignment of Assignor's Interest

Recorded: 2025-04-22 Pages: 29
Assignor
ADVANCED MICRO DEVICES INC.
Executed: 2024-11-08
Assignee
ONESTA IP, LLC
2 PAUL ROAD, WAYNE, PENNSYLVANIA, 19087
Covered Property (1)
Semiconductor Chip with Reinforcing Through-Silicon-Vias
Patent: 8,193,039 →
Application: 12/889,615 →
Publication: US 2012/0074579
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 24, 2010
From: REFAI-AHMED, GAMAL
To: ATI TECHNOLOGIES ULC
Reel/Frame 025037/0104 →
Assignment of Assignor's Interest Sep 24, 2010
From: SU, MICHAEL Z.; BLACK, BRYAN
To: ADVANCED MICRO DEVICES, INC.
Reel/Frame 025037/0162 →
Assignment of Assignor's Interest Nov 15, 2024
From: ATI TECHNOLOGIES ULC
To: ONESTA IP, LLC
Reel/Frame 069379/0556 →