Patent Assignment
Reel/Frame 025039/0177
Change of Name
Recorded: 2010-09-24
Pages: 4
Assignor
SIIMPEL CORPORATION
Executed: 2010-07-12
Assignee
TESSERA MEMS TECHNOLOGIES, INC.
400 EAST LIVE OAK AVENUE, ARCADIA, CALIFORNIA, 91006
Covered Property
(1)
Base, Payload and Connecting Structure and Methods of Making the Same
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Oct 12, 2005
From: SIWAVE, INC.
To: SIIMPEL CORPORATION
Reel/Frame 016878/0205 →
Patent Security Agreement
Nov 16, 2009
From: SIIMPEL CORPORATION
To: SCALE VENTURE PARTNERS II, L.P., AS COLLATERAL AGENT
Reel/Frame 023519/0715 →
Patent Security Agreement
Mar 31, 2010
From: SIIMPEL CORPORATION
To: SCALE VENTURE PARTNERS II, L.P.
Reel/Frame 024170/0078 →
Release of Security Interest
May 7, 2010
From: SCALE VENTURE PARTNERS II, L.P.
To: SIIMPEL CORPORATION
Reel/Frame 024351/0353 →
Change of Name
Aug 23, 2011
From: TESSERA MEMS TECHNOLOGIES, INC.
To: DIGITALOPTICS CORPORATION MEMS
Reel/Frame 026794/0897 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →