IP Library Assignment 025064/0288
Patent Assignment
Reel/Frame 025064/0288

Assignment of Assignor's Interest

Recorded: 2010-09-23 Pages: 4
Assignors
WIATR, MACIEJ
Executed: 2010-08-26
FORSBERG, MARKUS
Executed: 2010-09-06
KRONHOLZ, STEPHAN
Executed: 2010-08-26
BOSCHKE, ROMAN
Executed: 2010-08-26
Assignee
GLOBALFOUNDRIES INC.
MAPLES CORPORATE SERVICES LIMITED, PO BOX 309, UGLAND HOUSE, GRAND CAYMAN, KY1-1104, CAYMAN ISLANDS
Covered Property (1)
Buried Etch Stop Layer in Trench Isolation Structures for Superior Surface Planarity in Densely Packed Semiconductor Devices
Patent: 8,334,573 →
Application: 12/858,727 →
Publication: US 2011/0049637
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 27, 2019
From: GLOBALFOUNDRIES INC.
To: ALSEPHINA INNOVATIONS INC.
Reel/Frame 049612/0211 →
Release of Security Interest Nov 20, 2020
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES INC.
Reel/Frame 054636/0001 →