Assignment of Assignor's Interest

Recorded: 2010-10-06 Pages: 3

Assignor

PARK, SUNG-SOO

Executed: 2005-12-21

Assignee

SAMSUNG CORNING CO., LTD.

#472, SIN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 442-370, KOREA, REPUBLIC OF

Covered Property (1)

Wafer structure and epitaxial growth method for growing the same

Patent: 8,475,588 →

Application: 12/382,329 →

Publication: US 2009/0181525

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.