IP Library › Assignment 025123/0574
Patent Assignment
Reel/Frame 025123/0574

Change of Name

Recorded: 2010-10-08 Pages: 3
Assignor
Assignee
SAMSUNG CORNING PRECISION MATERIALS CO., LTD.
644-1, JINPYEONG-DONG, GUMI-SI, GYEONGSANGBUK-DO, 730-360, KOREA, REPUBLIC OF
Covered Property (1)
Wafer structure and epitaxial growth method for growing the same
Patent: 8,475,588 →
Application: 12/382,329 →
Publication: US 2009/0181525
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 6, 2010
From: PARK, SUNG-SOO
To: SAMSUNG CORNING CO., LTD.
Reel/Frame 025103/0393 →
Change of Name Oct 7, 2010
From: SAMSUNG CORNING CO., LTD.
To: SAMSUNG CORNING PRECISION GLASS CO., LTD.
Reel/Frame 025111/0349 →