Patent Assignment
Reel/Frame 025111/0349
Change of Name
Recorded: 2010-10-07
Pages: 9
Assignor
SAMSUNG CORNING CO., LTD.
Executed: 2007-12-31
Assignee
SAMSUNG CORNING PRECISION GLASS CO., LTD.
644-1, JINPYEONG-DONG, GUMI-SI, GYEONGSANGBUK-DO, 730-360, KOREA, REPUBLIC OF
Covered Property
(1)
Wafer structure and epitaxial growth method for growing the same
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.