Patent Assignment
Reel/Frame 025116/0792
Change of Name
Recorded: 2010-10-08
Pages: 12
Assignor
INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM
Executed: 2008-09-11
Assignee
IMEC
KAPELDREEF 75, LEUVEN, 3001, BELGIUM
Covered Property
(1)
Method for the Production of Thin Layer of Silicon by Utilization of Mismatch in Coefficient of Thermal Expansion Between Screen Printed Metal Layer and Silicon Mother Substrate
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 2, 2010
From: DROSS, FREDERIC; VAN KERSCHAVER, EMMANUEL; BEAUCARNE, GUY
To: IMEC
Reel/Frame 024930/0034 →
Assignment of Assignor's Interest
Oct 6, 2010
From: DROSS, FREDERIC; VAN KERSCHAVER, EMMANUEL; BEAUCARNE, GUY
To: INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM (IMEC)
Reel/Frame 025101/0346 →
Assignment of Assignor's Interest
Oct 6, 2010
From: IMEC
To: KATHOLIEKE UNIVERSITEIT LEUVEN, K.U. LEUVEN R&D
Reel/Frame 025102/0189 →