IP Library Assignment 025136/0522
Patent Assignment
Reel/Frame 025136/0522

Assignment of Assignor's Interest

Recorded: 2010-10-12 Pages: 3
Assignors
ANDO, KAZUNORI
Executed: 2010-08-31
IWASA, MASAYUKI
Executed: 2010-08-31
SHIGENO, MASATSUGU
Executed: 2010-08-31
MOMOTA, HIROUMI
Executed: 2010-08-31
WATANABE, KAZUTOSHI
Executed: 2010-08-31
Assignee
SII NANOTECHNOLOGY INC.
8, NAKASE 1-CHOME, MIHAMA-KU, CHIBA-SHI, CHIBA, 261-8507, JAPAN
Covered Property (1)
Softening Point Measuring Apparatus and Thermal Conductivity Measuring Apparatus
Patent: 8,608,373 →
Application: 12/806,364 →
Publication: US 2011/0038392
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Sep 25, 2014
From: SII NANOTECHNOLOGY INC.
To: HITACHI HIGH-TECH SCIENCE CORPORATION
Reel/Frame 033817/0078 →