Patent Assignment
Reel/Frame 025137/0859
Security Agreement
Recorded: 2010-10-15
Received: 2010-10-15
Pages: 10
Assignor
OEM GROUP, INC.
Executed: 2010-10-07
Assignee
THL CORPORATE FINANCE, INC.
100 FEDERAL STREET, 31ST FLOOR, BOSTON, MA, 02110, UNITED STATES
Covered Properties
(19)
Dry Etch Stop Process for Eliminating Electrical Shorting in Mram Device Structures
Application:
12/552,664 →
Reactor with Heated and Textured Electrodes and Surfaces
Application:
12/203,022 →
Method of drug delivery using a transdermal device having a phase change material
Application:
12/228,056 →
Dual-Deck Cassette Player Having an Integrated Digital Computer Serial Port
Application:
12/171,492 →
Dry Etch Stop Process for Eliminating Electrical Shorting in Mram Device Structures
Application:
11/724,556 →
Plasma Etch Reactor and Method
Application:
11/087,540 →
System and Method for Processing a Wafer Including Stop-on-Alumina Processing
Application:
10/937,660 →
System for, and Method of, Etching a Surface on a Wafer
Application:
10/633,839 →
Reactive Sputtering of Silicon Nitride Films by Rf Supported Dc Magnetron
Application:
10/446,005 →
Magnetron with adjustable target positioning
Application:
10/371,862 →
Magnetron with Controlled Dc Power
Application:
10/371,463 →
Cluster Tool with a Hollow Cathode Array
Application:
10/212,293 →
Plasma Etch Reactor and Method
Application:
10/156,478 →
Permanent Adherence of the Back End of a Wafer to an Electrical Component or Sub-Assembly
Application:
10/051,886 →
Flat Magnetron
Application:
09/949,181 →
Reactor with Heated and Textured Electrodes and Surfaces
Application:
09/888,365 →
Method for Minimizing the Critical Dimension Growth of a Feature on a Semiconductor Wafer
Application:
09/880,584 →
System for, and Method of, Etching a Surface on a Wafer
Application:
09/829,587 →
Dual Degas/Cool Loadlock Cluster Tool
Application:
09/798,048 →