Patent Assignment
Reel/Frame 025144/0200
Assignment of Assignor's Interest
Recorded: 2010-10-15
Pages: 3
Assignor
TAKANO, TAKAMASA
Executed: 2010-10-13
Assignee
DAI NIPPON PRINTING CO., LTD.
1-1-1, ICHIGAYA KAGACHO, SHINJUKU-KU, TOKYO, 162-8001, JAPAN
Covered Property
(1)
Method of Manufacturing a Through-Hole Electrode Substrate