IP Library › Assignment 025207/0189
Patent Assignment
Reel/Frame 025207/0189

Assignment of Assignor's Interest

Recorded: 2010-10-27 Pages: 3
Assignor
GAUDIN, GWELTAZ
Executed: 2010-10-04
Assignee
S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES
PARC TECHNOLOGIQUE DES FONTAINES,, 38190 BERNIN, FRANCE
Covered Property (1)
Method for Molecular Adhesion Bonding with Compensation for Radial Misalignment
Patent: 8,475,612 →
Application: 12/897,491 →
Publication: US 2012/0006463
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Mar 4, 2012
From: S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES
To: SOITEC
Reel/Frame 027800/0911 →
Assignment of Assignor's Interest Feb 4, 2020
From: SOITEC
To: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Reel/Frame 051707/0878 →