Patent Assignment
Reel/Frame 051707/0878
Assignment of Assignor's Interest
Recorded: 2020-02-04
Pages: 3
Assignor
SOITEC
Executed: 2019-12-09
Assignee
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
4-14-1 ASAHI-CHO, ATSUGI-SHI, KANAGAWA, JAPAN
Covered Properties
(21)
Photodetecting Device
Photodetecting Device
Method for Molecular Adhesion Bonding with Compensation for Radial Misalignment
Process for Measuring an Adhesion Energy, and Associated Substrates
Methods for Directly Bonding Together Semiconductor Structures, and Bonded Semiconductor Structures Formed Using Such Methods
Methods for Bonding Semiconductor Structures Involving Annealing Processes, and Bonded Semiconductor Structures and Intermediate Structures Formed Using Such Methods
Methods of Forming Bonded Semiconductor Structures Including Two or More Processed Semiconductor Structures Carried by a Common Substrate, and Semiconductor Structures Formed by Such Methods
Method of Fabricating a Back-Illuminated Image Sensor
Bonding Surfaces for Direct Bonding of Semiconductor Structures
Methods of Forming Bonded Semiconductor Structures Including Interconnect Layers Having One or More of Electrical, Optical, and Fluidic Interconnects Therein, and Bonded Semiconductor Structures Formed Using Such Methods
Methods of Forming Bonded Semiconductor Structures in 3D Integration Processes Using Recoverable Substrates, and Bonded Semiconductor Structures Formed by Such Methods
Methods of Forming Three Dimensionally Integrated Semiconductor Systems Including Photoactive Devices and Semiconductor-on-Insulator Substrates
Process for Realizing a Connecting Structure
Method of Fabricating a Multilayer Structure with Circuit Layer Transfer
Semiconductor Structures Including Fluidic Microchannels for Cooling and Related Methods
Interposers Including Fluidic Microchannels and Related Structures and Methods
Apparatus for Manufacturing Semiconductor Devices
Bonded Semiconductor Structures Including Two or More Processed Semiconductor Structures Carried by a Common Substrate
Method for Molecular Adhesion Bonding with Compensation for Radial Misalignment
Methods of Forming Three-Dimensionally Integrated Semiconductor Systems Including Photoactive Devices and Semiconductor-on-Insulator Substrates
Semiconductor Structures Including Fluidic Microchannels for Cooling and Related Methods
Related Assignments
(8)
Other recorded transfers of the patents in this record — the chain of ownership.
Change of Name
Feb 28, 2012
From: S.O.I. TEC SILICON ON INSULATOR TECHNOLOGIES; CHEMIN DES FRANQUES; PARC TECHNOLOGIES DES FONTAINES; BERNIN. FRANCE 38190
To: SOITEC
Reel/Frame 028138/0895 →
Change of Name
Mar 4, 2012
From: S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES
To: SOITEC
Reel/Frame 027800/0911 →
Assignment of Assignor's Interest
Aug 7, 2012
From: SADAKA, MARIAM
To: SOITEC
Reel/Frame 028740/0943 →
Assignment of Assignor's Interest
Aug 7, 2012
From: SADAKA, MARIAM
To: SOITEC
Reel/Frame 028740/0926 →
Assignment of Assignor's Interest
Nov 2, 2012
From: BROEKAART, MARCEL; RADU, IONUT
To: SOITEC
Reel/Frame 029236/0342 →
Change of Name
Jan 30, 2017
From: S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES
To: SOITEC
Reel/Frame 041551/0205 →
Change of Name
Jan 30, 2017
From: S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES
To: SOITEC
Reel/Frame 041550/0680 →
Assignment of Assignor's Interest
Jan 30, 2017
From: DUPONT, FREDERIC; CAYREFOURCQ, IAN
To: S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES
Reel/Frame 041119/0151 →