Patent Assignment
Reel/Frame 025240/0285
Assignment of Assignor's Interest
Recorded: 2010-11-03
Pages: 5
Assignors
ZHU, ZHENGYU
Executed: 2010-09-25
LI, YI
Executed: 2010-09-26
YANG, FANGFANG
Executed: 2010-09-27
Assignee
FAIRCHILD SEMICONDUCTOR CORPORATION
82 RUNNING HILL RD., MS35-4E, SOUTH PORTLAND, MAINE, 04106
Covered Property
(1)
High Bond Line Thickness for Semiconductor Devices
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement
Sep 19, 2016
From: FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 040075/0644 →
Assignment of Assignor's Interest
Aug 3, 2021
From: FAIRCHILD SEMICONDUCTOR CORPORATION
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 057694/0374 →
Release of Security Interest
Oct 28, 2021
From: DEUTSCHE BANK AG NEW YORK BRANCH
To: FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 057969/0206 →
Security Interest
Nov 12, 2021
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 058871/0799 →
Release of Security Interest in Patents Recorded at Reel 040075, Frame 0644
Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064070/0536 →
Release of Security Interest in Patents Recorded at Reel 058871, Frame 0799
Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 065653/0001 →