Patent Assignment
Reel/Frame 025302/0553
Assignment of Assignor's Interest
Recorded: 2010-10-29
Pages: 2
Assignor
KATO, OSAMU
Executed: 2010-09-27
Assignee
OKI SEMICONDUCTOR CO., LTD.
550-1 HIGASHIASAKAWA-CHO HACHIOUJI-SHI, TOKYO, 193-8550, JAPAN
Covered Property
(1)
Semiconductor Device Including Bottom Surface Wiring and Manfacturing Method of the Semiconductor Device
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 21, 2014
From: OKI SEMICONDUCTOR CO., LTD
To: LAPIS SEMICONDUCTOR CO., LTD.
Reel/Frame 032495/0483 →
Assignment of Assignor's Interest
Apr 11, 2022
From: LAPIS SEMICONDUCTOR CO., LTD.
To: ACHLYS TECHNOLOGIES INC.
Reel/Frame 059559/0280 →
Assignment of Assignor's Interest
Jun 19, 2022
From: ACHLYS TECHNOLOGIES INC.
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 060244/0398 →