IP Library Assignment 025312/0322
Patent Assignment
Reel/Frame 025312/0322

Assignment of Assignor's Interest

Recorded: 2010-11-04 Pages: 3
Assignors
SEIDEL, ROBERT
Executed: 2010-05-18
WERNER, THOMAS
Executed: 2010-05-19
Assignee
GLOBALFOUNDRIES INC.
MAPLES CORPORATE SERVICES LIMITED, PO BOX 309, UGLAND HOUSE, GRAND CAYMAN, KY1-1104, CAYMAN ISLANDS
Covered Property (1)
Metallization System of a Semiconductor Device Comprising Rounded Interconnects Formed by Hard Mask Rounding
Patent: 8,420,533 →
Application: 12/939,424 →
Publication: US 2011/0212616
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 27, 2019
From: GLOBALFOUNDRIES INC.
To: ALSEPHINA INNOVATIONS INC.
Reel/Frame 049612/0211 →
Release of Security Interest Nov 20, 2020
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES INC.
Reel/Frame 054636/0001 →