IP Library › Assignment 025351/0346
Patent Assignment
Reel/Frame 025351/0346

Assignment of Assignor's Interest

Recorded: 2010-11-12 Pages: 3
Assignor
TAWARA, SATOSHI
Executed: 2010-11-01
Assignee
MITSUBISHI HEAVY INDUSTRIES, LTD.
16-5, KONAN 2-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property (1)
Wafer Bonding Apparatus
Patent: 8,578,993 →
Application: 12/921,653 →
Publication: US 2011/0209832
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 7, 2016
From: MITSUBISHI HEAVY INDUSTRIES, LTD.
To: MITSUBISHI HEAVY INDUSTRIES MACHINE TOOL CO., LTD.
Reel/Frame 038896/0534 →