IP Library › Assignment 025356/0593
Patent Assignment
Reel/Frame 025356/0593

Change of Name

Recorded: 2010-11-12 Pages: 12
Assignor
Assignee
SUMCO TECHXIV CORPORATION
25-1, SHINOMIYA 3-CHOME, HIRATSUKA-SHI, KANAGAWA, 254-0014, JAPAN
Covered Property (1)
Nitrogen Doped Silicon Wafer and Manufacturing Method Thereof
Patent: 7,875,117 →
Application: 11/573,387 →
Publication: US 2007/0218570
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 18, 2007
From: NAKAMURA, KOUZO; MAEDA, SUSUMU; HAYASHIDA, KOUICHIROU; SUGIMAN, TAKAHISA
To: KOMATSU ELECTRONIC METALS CO., LTD.
Reel/Frame 019315/0287 →
Corrective Assignment to Correct the the Title Should Read: Nitrogen Doped Silicon Wafer and Manufacturing Method Thereof Previously Recorded on Reel 019315 Frame 0287. Assignor(S) Hereby Confirms the Assignment. Jun 28, 2007
From: NAKAMURA, KOUZO; MAEDA, SUSUMU; HAYASHIDA, KOUICHIROU; SUGIMAN, TAKAHISA
To: KOMATSU ELECTRONIC METALS CO., LTD.
Reel/Frame 019493/0913 →
Assignment of Assignor's Interest Nov 28, 2007
From: NAKAMURA, KOUZO; MAEDA, SUSUMU; HAYASHIDA, KOUICHIROU; SUGIMAN, TAKAHISA
To: KOMATSU ELECTRONIC METALS CO., LTD.
Reel/Frame 020203/0724 →