Patent Assignment
Reel/Frame 025389/0702
Assignment of Assignor's Interest
Recorded: 2010-11-18
Pages: 4
Assignors
HUANG, HUNG-WEN
Executed: 2010-11-17
HSIA, HSING-KUO
Executed: 2010-11-17
CHIU, CHING-HUA
Executed: 2010-11-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN ROAD 6, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Etching Growth Layers of Light Emitting Devices to Reduce Leakage Current
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 21, 2012
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 027899/0067 →
Change of Name
Feb 23, 2016
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037805/0762 →
Merger
Feb 23, 2016
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037805/0777 →