IP Library › Assignment 027899/0067
Patent Assignment
Reel/Frame 027899/0067

Assignment of Assignor's Interest

Recorded: 2012-03-21 Pages: 3
Assignor
Assignee
TSMC SOLID STATE LIGHTING LTD.
9, LI-HSIN 4TH ROAD, HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property (1)
Etching Growth Layers of Light Emitting Devices to Reduce Leakage Current
Patent: 8,592,242 →
Application: 12/949,316 →
Publication: US 2012/0126262
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 18, 2010
From: HUANG, HUNG-WEN; HSIA, HSING-KUO; CHIU, CHING-HUA
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 025389/0702 →
Change of Name Feb 23, 2016
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037805/0762 →
Merger Feb 23, 2016
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037805/0777 →