IP Library › Assignment 025390/0652
Patent Assignment
Reel/Frame 025390/0652

Assignment of Assignor's Interest

Recorded: 2010-11-22 Pages: 3
Assignors
DAS, RABINDRA N.
Executed: 2010-11-05
ROWLANDS, MICHAEL
Executed: 2010-10-25
Assignee
ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
1093 CLARK STREET, ENDICOTT, NEW YORK, 13760
Covered Property (1)
Liquid Crystal Polymer Layer for Encapsulation and Improved Hermiticity of Circuitized Substrates
Patent: 8,143,530 →
Application: 12/884,392 →
Publication: US 2012/0069288
Related Assignments (6)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement May 14, 2012
From: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.; EI TRANSPORTATION COMPANY LLC; ENDICOTT MEDTECH, INC.
To: PNC BANK, NATIONAL ASSOCIATION
Reel/Frame 028230/0798 →
Assignment of Security Agreement Mar 6, 2013
From: PNC BANK, NATIONAL ASSOCIATION
To: INTEGRIAN HOLDINGS, LLC
Reel/Frame 029938/0823 →
Security Agreement May 6, 2013
From: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.; EI TRANSPORTATION COMPANY LLC; ENDICOTT MEDTECH, INC.; INTEGRIAN HOLDINGS, LLC
To: M&T BANK
Reel/Frame 030359/0057 →
Security Agreement Jun 12, 2013
From: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
To: MAINES, WILLIAM; MAINES, DAVID
Reel/Frame 030599/0918 →
Release of Security Interest Feb 26, 2015
From: MAINES, WILLIAM; MAINES, DAVID
To: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
Reel/Frame 035098/0968 →
Assignment of Assignor's Interest Apr 16, 2015
From: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.
To: I3 ELECTRONICS, INC.
Reel/Frame 035442/0569 →