Liquid crystal polymer layer for encapsulation and improved hermiticity of circuitized substrates

1. A substrate for use in electronic packages comprising:

a) a layer of copper-invar-copper (CIC) having an upper surface and a lower surface;

b) a first layer of polytetrafluoroethylene (PTFE) disposed on said upper surface of said CIC layer;

c) a second layer of PTFE disposed on said lower surface of said CIC layer;

d) a top layer of etched copper foil having etched spaces disposed on said upper surface of said first PTFE layer;

e) a bottom layer of etched copper foil having etched spaces disposed on said lower surface of said second PTFE layer;

f) a first layer of liquid crystal polymer (LCP) having an upper surface and a lower surface disposed on said top layer of etched copper foil;

g) a second layer of LCP having an upper surface and a lower surface disposed on said bottom layer of etched copper foil;

h) a top external layer of etched copper foil disposed on said upper surface of said first and said second LCP layers; and

i) bottom external layers of etched copper foil disposed on said lower surface of said first LCP layer and said second LCP layer, respectively.

2. The substrate for use in electronic packages based on claim 1 , wherein all said layers are laminated.

3. The substrate for use in electronic packages based on claim 1 , wherein a portion of said first LCP layer and said second LCP layer is disposed in said etched spaces of said top and said bottom copper foil layers, respectively.

4. The substrate for use in electronic packages based on claim 1 , wherein said first and said second layers of LCP comprise aromatic polyester polymers.

5. The substrate for use in electronic packages based on claim 3 , wherein said first and said second layers of LCP comprise aromatic polyester polymers.

6. The substrate for use in electronic packages based on claim 1 , wherein the dimensions of said first and said second layers of LCP are greater than the dimensions of said CIC layer and than said first and said second layers of PTFE.

7. A method of forming a near hermetically sealed substrate, the steps comprising:

a) providing a CIC layer;

b) disposing a first polytetrafluoroethylene (PTFE) layer on an upper surface of said CIC layer;

c) disposing a second PTFE layer on a lower surface of said CIC layer;

d) disposing a top copper foil layer on said first PTFE layer;

e) disposing a bottom copper foil layer on said second PTFE layer;

f) laminating all of said layers together;

g) etching said top copper foil layer to create at least a first cavity;

h) etching said bottom copper foil layer to create at least a second cavity;

i) disposing a first layer of liquid crystal polymer (LCP) on said top layer of etched copper foil;

j) disposing a second layer of LCP on said bottom layer of etched copper foil;

k) disposing an external upper copper foil layer on said first LCP layer;

l) disposing an external lower copper foil layer on said second LCP layer;

m) laminating all of said layers together;

n) etching said external upper layer of copper foil; and

o) etching said external lower layer of copper foil.

8. The method of forming a near hermetically sealed substrate based on claim 7 , wherein a portion of said first LCP layer and said second LCP layer is disposed in said cavities of said top and said bottom copper foil layers, respectively.

9. The method of forming a near hermetically sealed substrate based on claim 8 , wherein said first and said second layers of LCP comprise aromatic polyester polymers.

10. The method of forming a near hermetically sealed substrate based on claim 7 , wherein said first layer and said second layer of LCP comprise aromatic polyester polymers.