Patent Assignment
Reel/Frame 025443/0543
Assignment of Assignor's Interest
Recorded: 2010-12-02
Pages: 13
Assignors
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Executed: 2010-06-25
HEWLETT-PACKARD COMPANY
Executed: 2010-06-25
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Properties
(3)
Microprocessor Chip Having a Memory That Is Reconfigurable to Function as on-Chip Main Memory or an on-Chip Cache
Patent:
6,678,790 →
Application:
08/871,295 →
Integrated Hierarchical Memory Overlay Method for Improved Processor Performance
Patent:
6,209,061 →
Application:
09/032,969 →
Memory Manager for a Common Memory
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 8, 1997
From: KUMAR, RAJENDRA
To: HEWLETT-PACKARD COMPANY
Reel/Frame 008850/0809 →
Assignment of Assignor's Interest
Jun 9, 1998
From: NELSON, MARVIN D.; MATTHEWS, RANDY J.
To: HEWLETT-PACKARD COMPANY
Reel/Frame 009255/0191 →
Merger
Jan 16, 2001
From: HEWLETT-PACKARD COMPANY
To: HEWLETT-PACKARD COMPANY
Reel/Frame 011523/0469 →
Assignment of Assignor's Interest
Mar 11, 2011
From: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.; HEWLETT-PACKARD COMPANY
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 026008/0690 →