IP Library Assignment 025478/0477
Patent Assignment
Reel/Frame 025478/0477

Assignment of Assignor's Interest

Recorded: 2010-12-08 Pages: 4
Assignors
KIM, HYOUNG SIK
Executed: 2010-11-15
LEE, JUNG HEE
Executed: 2010-11-15
CASTILLO, DANIEL HERNANDEZ, II
Executed: 2010-12-01
HENRY, JAMES MATTHEW
Executed: 2010-12-01
Assignee
DUPONT AIR PRODUCTS NANOMATERIALS, INC.
2441 WEST ERIE DRIVE, TEMPE, ARIZONA, 85282
Covered Property (1)
Method for Exposing Through-Base Wafer Vias for Fabrication of Stacked Devices
Application: 12/888,872 →
Publication: US 2011/0237079
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 3, 2012
From: DUPONT AIR PRODUCTS NANOMATERIALS LLC
To: AIR PRODUCTS AND CHEMICALS, INC.
Reel/Frame 028487/0205 →
Assignment of Assignor's Interest Feb 20, 2017
From: AIR PRODUCTS AND CHEMICALS, INC.
To: VERSUM MATERIALS US, LLC
Reel/Frame 041772/0733 →