Patent Assignment
Reel/Frame 025482/0476
Assignment of Assignor's Interest
Recorded: 2010-12-09
Pages: 4
Assignee
UTAC THAI LIMITED
237 LASALLE ROAD, BANGNA, BANGKOK, 10260, THAILAND
Covered Property
(1)
Molded Leadframe Substrate Semiconductor Package
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 1, 2016
From: UTAC THAI LIMITED
To: UTAC HEADQUARTERS PTE. LTD.
Reel/Frame 037959/0937 →
Corrective Assignment to Add the Annex a and the Annex B Which Was Inadvertently Leftout in the Original Assignment Document Previously Recorded on Reel 037959 Frame 0937. Assignor(S) Hereby Confirms the Assignment.
Jul 8, 2016
From: UTAC THAI LIMITED
To: UTAC HEADQUARTERS PTE. LTD.
Reel/Frame 039902/0302 →