Patent Assignment
Reel/Frame 025484/0085
Assignment of Assignor's Interest
Recorded: 2010-12-09
Pages: 5
Assignors
CHO, SUNGWON
Executed: 2010-11-15
CHOI, DAESIK
Executed: 2010-11-15
PARK, HYUNGSANG
Executed: 2010-11-15
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Integrated Circuit Packaging System with Device Mount and Method of Manufacture Thereof
Application:
12/946,841 →
Publication:
US 2012/0119345
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Aug 6, 2015
From: STATS CHIPPAC, INC.; STATS CHIPPAC LTD.
To: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
Reel/Frame 036288/0748 →
Release of Security Interest
Jun 17, 2020
From: CITICORP INTERNATIONAL LIMITED, AS COMMON SECURITY AGENT
To: STATS CHIPPAC, INC.; STATS CHIPPAC PTE. LTD. FORMERLY KNOWN AS STATS CHIPPAC LTD.
Reel/Frame 053476/0094 →