Patent Assignment
Reel/Frame 025485/0133
Assignment of Assignor's Interest
Recorded: 2010-12-09
Pages: 4
Assignors
CHUMAKOV, DMYTRO
Executed: 2010-09-01
GRILLBERGER, MICHAEL
Executed: 2010-09-01
BERTHOLD, HEIKE
Executed: 2010-09-01
REICHE, KATRIN
Executed: 2010-09-01
Assignee
GLOBALFOUNDRIES INC.
MAPLES CORPORATE SERVICES LIMITED, PO BOX 309, UGLAND HOUSE, GRAND CAYMAN, KY1-1104, CAYMAN ISLANDS
Covered Property
(1)
Stress Reduction in Chip Packaging by a Stress Compensation Region Formed Around the Chip
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Nov 29, 2018
From: GLOBALFOUNDRIES INC.
To: WILMINGTON TRUST, NATIONAL ASSOCIATION
Reel/Frame 049490/0001 →
Release of Security Interest
Nov 19, 2020
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES INC.
Reel/Frame 054479/0842 →
Assignment of Assignor's Interest
Nov 19, 2020
From: GLOBALFOUNDRIES INC.
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 054482/0862 →
Release of Security Interest
Nov 20, 2020
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES INC.
Reel/Frame 054636/0001 →