Patent Assignment
Reel/Frame 025615/0551
Assignment of Assignor's Interest
Recorded: 2010-12-22
Pages: 2
Assignors
KIM, EY YONG
Executed: 2010-09-15
SHIN, YOUNG HWAN
Executed: 2010-09-15
CHO, SOON JIN
Executed: 2010-09-15
KIM, JONG YONG
Executed: 2010-09-15
LEE, JIN SEOK
Executed: 2010-09-15
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
314 MAETAN-3-DONG, YEONGTONG-GU, SUWON, GYUNGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Flip Chip Package and Method of Manufacturing the Same