Assignment of Assignor's Interest

Recorded: 2011-01-12 Pages: 3

Assignors

NAGANUMA, NOBUYUKI

Executed: 2010-11-04

TAKAHASHI, MICHIMASA

Executed: 2010-11-08

AOYAMA, MASAKAZU

Executed: 2010-11-10

Assignee

IBIDEN CO., LTD.

2-1, KANDA-CHO, OGAKI-SHI, GIFU, 503-8604, JAPAN

Covered Property (1)

Flex-Rigid Wiring Board and Method for Manufacturing the Same

Patent: 8,658,904 →

Application: 12/914,064 →

Publication: US 2011/0180306

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.