Patent Assignment
Reel/Frame 067038/0144
Nunc Pro Tunc Assignment
Recorded: 2024-04-09
Pages: 4
Assignor
IBIDEN CO., LTD.
Executed: 2024-03-20
Assignee
BEIJING FUTUREPRINT ELECTRONICS CO., LTD.
15#, RONGCHANG EAST STREET, BDA, BEIJING, CHINA
Covered Properties
(7)
Flex-Rigid Wiring Board and Method for Manufacturing the Same
Multi-Piece Board and Method for Manufacturing the Same
Printed Wiring Board
Printed Wiring Board and Method for Manufacturing Printed Wiring Board
Printed Wiring Board
Printed Wiring Board
Wiring Substrate
Related Assignments
(6)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 12, 2011
From: NAGANUMA, NOBUYUKI; TAKAHASHI, MICHIMASA; AOYAMA, MASAKAZU
To: IBIDEN CO., LTD.
Reel/Frame 025624/0956 →
Assignment of Assignor's Interest
May 5, 2016
From: KITAGAWA, KATSUTOSHI
To: IBIDEN CO., LTD.
Reel/Frame 038464/0395 →
Assignment of Assignor's Interest
Feb 8, 2017
From: ISHIHARA, TERUYUKI
To: IBIDEN CO., LTD.
Reel/Frame 041199/0421 →
Assignment of Assignor's Interest
Mar 8, 2019
From: ADACHI, TAKEMA; MAKINO, TOSHIHIDE; NOGUCHI, HIDETOSHI
To: IBIDEN CO., LTD.
Reel/Frame 048546/0968 →
Assignment of Assignor's Interest
Apr 8, 2019
From: ADACHI, TAKEMA; MAKINO, TOSHIHIDE; NOGUCHI, HIDETOSHI
To: IBIDEN CO., LTD.
Reel/Frame 048814/0589 →
Assignment of Assignor's Interest
Apr 29, 2020
From: NAKAMURA, TAKENOBU; YAMAZAKI, TAKAHIRO; YAMAUCHI, TAKASHI; MAKINO, TOSHIHIDE
To: IBIDEN CO., LTD.
Reel/Frame 052527/0535 →