Patent Assignment
Reel/Frame 041199/0421
Assignment of Assignor's Interest
Recorded: 2017-02-08
Pages: 2
Assignor
ISHIHARA, TERUYUKI
Executed: 2017-01-26
Assignee
IBIDEN CO., LTD.
1, KANDACHO 2-CHOME, OGAKI, GIFU, 503-8604, JAPAN
Covered Property
(1)
Printed Wiring Board and Method for Manufacturing Printed Wiring Board
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.