Patent Assignment
Reel/Frame 025629/0459
Assignment of Assignor's Interest
Recorded: 2011-01-13
Pages: 5
Assignors
HSIA, HSING-KUO
Executed: 2010-11-22
YU, CHIH-KUANG
Executed: 2010-11-22
KUO, HUNG-YI
Executed: 2010-11-22
HUANG, HUNG-WEN
Executed: 2010-11-23
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Wafer Level Conformal Coating for Led Devices
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 21, 2012
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
To: TSMC SOLID STATE LIGHTING LTD.
Reel/Frame 027902/0820 →
Change of Name
Feb 23, 2016
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037805/0762 →
Merger
Feb 23, 2016
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037805/0777 →