IP Library › Assignment 027902/0820
Patent Assignment
Reel/Frame 027902/0820

Assignment of Assignor's Interest

Recorded: 2012-03-21 Pages: 3
Assignor
Assignee
TSMC SOLID STATE LIGHTING LTD.
9, LI-HSIN 4TH ROAD, HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property (1)
Wafer Level Conformal Coating for Led Devices
Patent: 8,415,183 →
Application: 12/951,662 →
Publication: US 2012/0129282
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 13, 2011
From: HSIA, HSING-KUO; YU, CHIH-KUANG; KUO, HUNG-YI; HUANG, HUNG-WEN
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 025629/0459 →
Change of Name Feb 23, 2016
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037805/0762 →
Merger Feb 23, 2016
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037805/0777 →