Assignment of Assignor's Interest

Recorded: 2011-01-13 Pages: 3

Assignor

VACUUM METALLURGICAL CO., LTD.

Executed: 2010-09-21

Assignee

ULVAC, INC.

2500 HAGISONO, CHIGASAKI-OSHI, KANAGAWA, 253-8543, JAPAN

Covered Property (1)

Method of Thin Film Forming on Semiconductor Substrate

Patent: 5,953,629 →

Application: 08/706,679 →

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.