Patent Assignment
Reel/Frame 025691/0300
Assignment of Assignor's Interest
Recorded: 2011-01-25
Pages: 8
Assignors
MAEDA, TORU
Executed: 2010-12-24
TANIKAWA, TETSURO
Executed: 2010-12-24
TERAMOTO, AKINOBU
Executed: 2010-12-24
ODA, MASAAKI
Executed: 2010-12-24
Assignees
SHINKAWA LTD.
51-1, INADAIRA 2-CHOME, MUSASHIMURAYAMA-SHI, TOKYO, 208-8585, JAPAN
TOHOKU UNIVERSITY
1-1, KATAHIRA 2-CHOME, AOBA-KU, SENDAI-SHI, MIYAGI, 980-8577, JAPAN
ULVAC, INC.
2500, HAGISONO, CHIGASAKI-SHI, KANAGAWA, 253-8543, JAPAN
Covered Property
(1)
Metal Nanoink and Process for Producing the Metal Nanoink, and Die Bonding Method and Die Bonding Apparatus Using the Metal Nanoink
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.