Patent Assignment
Reel/Frame 025696/0230
Assignment of Assignor's Interest
Recorded: 2011-01-25
Pages: 5
Assignors
WU, ALBERT
Executed: 2011-01-19
CHEN, ROAWEN
Executed: 2011-01-20
HAN, CHUNG CHYUNG
Executed: 2011-01-19
LIOU, SHIANN-MING
Executed: 2011-01-19
WEI, CHIEN-CHUAN
Executed: 2011-01-19
CHANG, RUNZI
Executed: 2011-01-19
WU, SCOTT
Executed: 2011-01-19
CHENG, CHUAN-CHENG
Executed: 2011-01-19
Assignee
MARVELL SEMICONDUCTOR, INC.
5488 MARVELL LANE, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Package Assembly Including a Semiconductor Substrate in Which a First Portion of a Surface of the Semiconductor Substrate Is Recessed Relative to a Second Portion of the Surface of the Semiconductor Substrate to Form a Recessed Region in the Semiconductor Substrate
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 25, 2011
From: MARVELL SEMICONDUCTOR, INC.
To: MARVELL INTERNATIONAL LTD.
Reel/Frame 025696/0243 →
Assignment of Assignor's Interest
Jan 25, 2011
From: MARVELL INTERNATIONAL, LTD.
To: MARVELL WORLD TRADE LTD.
Reel/Frame 025696/0283 →
License
Jan 25, 2011
From: MARVELL WORLD TRADE LTD.
To: MARVELL INTERNATIONAL LTD.
Reel/Frame 025696/0297 →
Assignment of Assignor's Interest
Jan 29, 2020
From: MARVELL WORLD TRADE LTD.
To: MARVELL INTERNATIONAL LTD.
Reel/Frame 051778/0537 →
Assignment of Assignor's Interest
Feb 20, 2020
From: MARVELL INTERNATIONAL LTD.
To: CAVIUM INTERNATIONAL
Reel/Frame 052918/0001 →
Assignment of Assignor's Interest
Jun 16, 2020
From: CAVIUM INTERNATIONAL
To: MARVELL ASIA PTE, LTD.
Reel/Frame 053475/0001 →