IP Library Assignment 025696/0283
Patent Assignment
Reel/Frame 025696/0283

Assignment of Assignor's Interest

Recorded: 2011-01-25 Pages: 3
Assignor
MARVELL INTERNATIONAL, LTD.
Executed: 2011-01-21
Assignee
MARVELL WORLD TRADE LTD.
L'HORIZON, GUNSITE ROAD, BRITTONS HILL, ST. MICHAEL, BB14027, BARBADOS
Covered Property (1)
Package Assembly Including a Semiconductor Substrate in Which a First Portion of a Surface of the Semiconductor Substrate Is Recessed Relative to a Second Portion of the Surface of the Semiconductor Substrate to Form a Recessed Region in the Semiconductor Substrate
Patent: 9,257,410 →
Application: 13/012,644 →
Publication: US 2011/0186998
Related Assignments (6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 25, 2011
From: WU, ALBERT; CHEN, ROAWEN; HAN, CHUNG CHYUNG; LIOU, SHIANN-MING
To: MARVELL SEMICONDUCTOR, INC.
Reel/Frame 025696/0230 →
Assignment of Assignor's Interest Jan 25, 2011
From: MARVELL SEMICONDUCTOR, INC.
To: MARVELL INTERNATIONAL LTD.
Reel/Frame 025696/0243 →
License Jan 25, 2011
From: MARVELL WORLD TRADE LTD.
To: MARVELL INTERNATIONAL LTD.
Reel/Frame 025696/0297 →
Assignment of Assignor's Interest Jan 29, 2020
From: MARVELL WORLD TRADE LTD.
To: MARVELL INTERNATIONAL LTD.
Reel/Frame 051778/0537 →
Assignment of Assignor's Interest Feb 20, 2020
From: MARVELL INTERNATIONAL LTD.
To: CAVIUM INTERNATIONAL
Reel/Frame 052918/0001 →
Assignment of Assignor's Interest Jun 16, 2020
From: CAVIUM INTERNATIONAL
To: MARVELL ASIA PTE, LTD.
Reel/Frame 053475/0001 →