IP Library Assignment 025722/0898
Patent Assignment
Reel/Frame 025722/0898

Merger

Recorded: 2011-01-31 Pages: 15
Assignor
SHOWA HIGHPOLYMER CO., LTD.
Executed: 2010-07-01
Assignee
SHOWA DENKO K.K.
13-9, SHIBADAIMON 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Properties (16)
Curable Resin Composition
Patent: 5,128,428 →
Application: 07/680,364 →
Method for Producing Saturated Polyester
Patent: 5,306,787 →
Application: 07/797,033 →
Method for Manufacturing Biodegradable High Molecular Aliphatic Polyester
Patent: 5,310,782 →
Application: 08/069,605 →
Method of Producing a High Molecular Weight Aliphatic Polyester and Film Thereof
Patent: 5,436,056 →
Application: 08/107,776 →
Method of Producing an Ultra High Molecular Weight Polymer Emulsion
Patent: 5,610,256 →
Application: 08/309,610 →
Photosensitive Resin Composition
Patent: 6,727,042 →
Application: 10/169,927 →
Publication: US 2003/0087189
Method for Producing Aqueous Biodegradable Polyester Dispersion
Patent: 6,716,911 →
Application: 10/311,070 →
Publication: US 2003/0181630
Low Specific Gravity Unsaturated Polyester Resin Compositions For Lamp Reflectors And Molded Articles Thereof
Application: 10/593,633 →
Publication: US 2007/0197687
Curable Polyvinyl Benzyl Compound and Process for Producing the Same
Patent: 7,514,379 →
Application: 10/954,214 →
Publication: US 2005/0176909
Polycarboxylic Acid Resin From Epoxy Resin, Dibasic Acid, Unsaturated Monocarboxylic Acid, Then Anhydride
Application: 11/876,016 →
Publication: US 2008/0108726
Unsaturated Polyester Resin Compositions for Lamp Reflectors and Molded Articles Thereof
Application: 11/885,956 →
Publication: US 2008/0097030
Method for Producing an Amino Group-Containing Phosphate Compound, and a Flame-Retardant Resin and Flame-Retardant Resin Composition
Application: 12/304,053 →
Publication: US 2010/0298506
Fiber Reinforced Plastic Molding Material and Fiber Reinforced Plastic Molded Article
Patent: 8,148,469 →
Application: 12/599,750 →
Publication: US 2010/0311887
Wet Friction Material
Patent: 8,222,317 →
Application: 12/740,274 →
Publication: US 2010/0256259
Foamable Resin Composition and Foamed Body
Application: 12/808,976 →
Publication: US 2011/0230576
Adhesive for Corrugated Cardboard for Preventing Package Stack Crumbling and Method of Preventing Package Stack Crumbling with the Same
Application: 12/864,260 →
Publication: US 2010/0307679
Related Assignments (17)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignors Interest. Feb 5, 1992
From: TAKIYAMA, EIICHIRO; NIIKURA, ISAMU; HATANO, YOSITAKA
To: SHOWA HIGHPOLYMER CO., LTD.
Reel/Frame 006004/0142 →
Assignment of Assignors Interest. Apr 27, 1992
From: SHINOHARA, NORIO; OHTANI, KAZUO; HANYUDA, TOSHIAKI
To: SHOWA HIGHPOLYMER CO., LTD.
Reel/Frame 006094/0270 →
Assignment of Assignor's Interest Jun 1, 1993
From: TAKIYAMA, EIICHIRO; FUJIMAKI, TAKASHI; SEKI, SHIGEKATU; HOKARI, TAKAO
To: SHOWA HIGHPOLYMER CO., LTD.
Reel/Frame 006609/0317 →
Assignment of Assignor's Interest Aug 18, 1993
From: TAKIYAMA, EIICHIRO; HATANO, YOSHITAKA; FUJIMAKI, TAKASHI; SEKI, SHIGEKATU
To: SHOWA HIGHPOLYMER CO., LTD.
Reel/Frame 006930/0018 →
Assignment of Assignor's Interest Jul 11, 2002
From: TAKAGI, TORU; YADA, MITSUHIRO; SAITOU, TAKESHI
To: SHOWA HIGHPOLYMER CO., LTD
Reel/Frame 013284/0737 →
Assignment of Assignor's Interest Dec 13, 2002
From: DOI, YUKIO; ISHIOKA, RYOJI; OKINO, YOSHIRO; IMAIZUMI, MITSUHIRO
To: SHOWA HIGHPOLYMER CO., LTD.
Reel/Frame 013921/0732 →
Re-Record to Correct the Name of the Assignee, Previously Recorded on Reel 013291 Frame 0732, Assignor Confirms the Assignment of the Entire Interest. Sep 12, 2003
From: DOI, YUKIO; ISHIOKA, RYOJI; OKINO, YOSHIRO; IMAIZUMI, MITSUHIRO
To: SHOWA HIGH POLYMER CO., LTD.
Reel/Frame 014483/0992 →
Assignment of Assignor's Interest Mar 7, 2005
From: NISHIGUCHI, SHOUJI; IKEYA, TATSUHIRO; YOSHIDA, HARUO; SHIBATA, JYOUJI
To: SHOWA HIGHPOLYMER CO., LTD
Reel/Frame 016336/0642 →
Assignment of Assignor's Interest Sep 21, 2006
From: YAMANE, KUNIO; HAGIWARA, NOBUHITO; ITAMI, SHOTARO; KANEOKA, HIDEKAZU
To: SHOWA HIGHPOLYMER CO., LTD
Reel/Frame 018346/0616 →
Assignment of Assignor's Interest Sep 10, 2007
From: KANEOKA, HIDEKAZU; YAMANE, KUNIO
To: SHOWA HIGHPOLYMER CO., LTD
Reel/Frame 019856/0242 →
Assignment of Assignor's Interest Dec 9, 2008
From: KAMATA, HIROTOSHI; TAKAHASHI, KENTAROU; LI, HUI; IONIN, BORIS
To: SHOWA HIGHPOLYMER CO., LTD.
Reel/Frame 021948/0982 →
Assignment of Assignor's Interest Nov 11, 2009
From: KUROKI, KUNIHIRO; OOTSU, NAOKI
To: SHOWA HIGHPOLYMER CO., LTD.
Reel/Frame 023503/0548 →
Assignment of Assignor's Interest Apr 28, 2010
From: KOZUTSUMI, TOSHIHIKO
To: SHOWA HIGHPOLYMER CO., LTD.
Reel/Frame 024303/0757 →
Assignment of Assignor's Interest Jun 18, 2010
From: TAKAHASHI, KEI; KOTANI, TERUMITSU; NISHIIKE, HARUKI; KANI, HIROSHI
To: SHOWA HIGHPOLYMER CO., LTD.; HOKKAIDO GOVERNMENT
Reel/Frame 024556/0891 →
Assignment of Assignor's Interest Jul 23, 2010
From: YOTSUMOTO, SHIGEMITSU; FUJII, TOYOHIKO
To: HIKARIBOND CO., LTD.; KANAE CHEMICALS CO., LTD.; SHOWA HIGHPOLYMER CO., LTD.
Reel/Frame 024731/0177 →
Assignment of Assignor's Interest Feb 20, 2016
From: SHOWA DENKO K.K.
To: AICA SDK PHENOL CO., LTD.
Reel/Frame 037781/0762 →
Merger Jan 17, 2019
From: AICA SDK PHENOL CO., LTD.
To: AICA KOGYO CO., LTD.
Reel/Frame 048039/0579 →