Curable polyvinyl benzyl compound and process for producing the same
A curable polyvinyl benzyl compound represented by the following general formula (1): wherein R 1 represents a C 2-20 organic group, R 2 represents a hydrogen atom, etc., x is an integer of 0 to 4, and n is an integer of 0 to 2. The compound is obtained by reacting a fluorene compound with a vinylbenzyl halide in the presence of an alkali.
1. A curable polyvinyl benzyl compound represented by the following general formula 1:
(wherein R 1 is a divalent organic group having 2 to 20 carbon atoms, R 2 is at least one organic group selected from the group consisting of a hydrogen atom, a halogen atom, an alkyl group, an alkoxy group and a thioalkoxy group having 1 to 5 carbon atoms, which may be the same or different, and an aryl group, where x is an integer of 0 to 4, and n is an integer of 1 to 20).
2. A curable resin composition prepared by mixing a curable polyvinyl benzyl compound according to claim 1 with a monomer, an oligomer and/or a polymer which is copolymerizable with said compound.
3. A cured resin obtained by curing a curable polyvinyl benzyl compound according to claim 1 .
4. A cured resin obtained by curing a curable resin composition according to claim 2 .
5. A high-frequency substrate obtained by curing a curable polyvinyl benzyl compound according to claim 1 .
6. A high-frequency substrate obtained by curing a curable resin composition according to claim 2 .
7. A prepreg obtained by impregnating a curable resin composition according to claim 2 with a fiber material.
8. A high-frequency substrate obtained by heating and pressurizing either a single prepreg according to claim 7 or a laminate of the prepregs according to claim 7 .
9. A metal-lined high-frequency substrate obtained by placing a metal foil onto either a single prepreg according to claim 7 or a laminate of the prepregs according to claim 7 , through heating and pressurizing.
10. A metal foil having a resin obtained by applying a curable resin composition according to claim 2 to a metal foil to be integrated.
11. A multi-layer laminate substrate characterized by having a curable resin composition according to claim 2 applied to a conductive layer, which is polymerized and cured, and a conductive layer formed on a cured product.