Patent Assignment
Reel/Frame 025735/0703
Assignment of Assignor's Interest
Recorded: 2011-02-02
Pages: 4
Assignors
LO, C.P.
Executed: 2000-02-03
HUANG, DANIEL A.
Executed: 2000-02-03
HUDSON, PETE
Executed: 2000-02-06
Assignee
HUGHES ELECTRONICS CORPORATION
BLDG. 001, M.S. A109, EL SEGUNDO, CALIFORNIA, 90245
Covered Property
(1)
Method of Assembling Chip Scale Packaging
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 12, 2011
From: HUGHES ELECTRONICS CORPORATION
To: THE BOEING COMPANY
Reel/Frame 026111/0765 →
Assignment of Assignor's Interest
Aug 1, 2011
From: THE BOEING COMPANY
To: EPHALION FUND LIMITED LIABILITY COMPANY
Reel/Frame 026680/0262 →
Merger
Jan 19, 2016
From: EPHALION FUND LIMITED LIABILITY COMPANY
To: GULA CONSULTING LIMITED LIABILITY COMPANY
Reel/Frame 037526/0293 →