Patent Assignment
Reel/Frame 026111/0765
Assignment of Assignor's Interest
Recorded: 2011-04-12
Pages: 3
Assignor
HUGHES ELECTRONICS CORPORATION
Executed: 2000-09-05
Assignee
THE BOEING COMPANY
100 NORTH RIVERSIDE PLAZA, CHICAGO, ILLINOIS, 60606-2016
Covered Property
(1)
Method of Assembling Chip Scale Packaging
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 2, 2011
From: LO, C.P.; HUANG, DANIEL A.; HUDSON, PETE
To: HUGHES ELECTRONICS CORPORATION
Reel/Frame 025735/0703 →
Assignment of Assignor's Interest
Aug 1, 2011
From: THE BOEING COMPANY
To: EPHALION FUND LIMITED LIABILITY COMPANY
Reel/Frame 026680/0262 →
Merger
Jan 19, 2016
From: EPHALION FUND LIMITED LIABILITY COMPANY
To: GULA CONSULTING LIMITED LIABILITY COMPANY
Reel/Frame 037526/0293 →