IP Library › Granted Patent US 6,757,968
Granted Patent Utility
US 6,757,968 · Confirmation No. 8153

METHOD OF ASSEMBLING CHIP SCALE PACKAGING

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 Code Description Pages PDF
2011-09-06 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2011-09-06 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2010-02-23 EBCC.AD Notice of Change of Address Place in File Wrapper Due to Electronic Business Center(EBC) Customer Number Update 1 View
2004-05-24 IFEE Issue Fee Payment (PTO-85B) 1 View
2002-08-30 TRNA Transmittal of New Application 9 View
2002-08-30 A.PE Preliminary Amendment 7 View
2002-08-30 SPEC Specification 10 View
2002-08-30 CLM Claims 5 View
2002-08-30 ABST Abstract 1 View
2002-08-30 DRW Drawings-only black and white line drawings 1 View
2002-08-30 OATH Oath or Declaration filed 6 View
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Quick Facts
Patent No.
US 6,757,968
App. No.
10/232,273
Filed
2002-08-30
Granted
2004-07-06
Pub. No.
US20030011998A1
Art Unit
3729
PTA
-19 days