IP Library › Assignment 025769/0376
Patent Assignment
Reel/Frame 025769/0376

Assignment of Assignor's Interest

Recorded: 2011-02-08 Pages: 4
Assignors
HARADA, KAZUHIRO
Executed: 2011-01-12
ITATANI, HIDEHARU
Executed: 2011-01-12
HORII, SADAYOSHI
Executed: 2011-01-12
Assignee
HITACHI KOKUSAI ELECTRIC INC.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO, 1018980, JAPAN
Covered Property (1)
Method of Manufacturing Semiconductor Device, Method of Processing Substrate and Substrate Processing Apparatus
Patent: 8,728,935 →
Application: 12/974,884 →
Publication: US 2011/0151660
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 31, 2018
From: HITACHI KOKUSAI ELECTRIC INC.
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 047995/0490 →