Patent Assignment
Reel/Frame 025782/0606
Assignment of Assignor's Interest
Recorded: 2011-02-01
Pages: 3
Assignee
GLOBAL UNICHIP CORPORATION
NO. 10, LI-HSIN 6TH RD., HSINCHU SCIENCE PARK, HSINCHU CITY 300, R.O.C., TAIWAN
Covered Property
(1)
Semiconductor Package Device with Cavity Structure and the Packaging Method Thereof
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.