Patent Assignment
Reel/Frame 038555/0838
Assignment of Assignor's Interest
Recorded: 2016-05-12
Pages: 4
Assignor
GLOBAL UNICHIP CORPORATION
Executed: 2016-05-06
Assignees
GLOBAL UNICHIP CORPORATION
NO. 10, LI-HSIN 6TH RD., HSINCHU SCIENCE PARK, HSINCHU CITY, 300, TAIWAN
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
NO. 8, LI-HSIN 6TH RD., HSINCHU SCIENCE PARK, HSINCHU CITY, 300, TAIWAN
Covered Properties
(14)
Burn-In Socket and Testing Fixture Using the Same
Data transfer protection apparatus for flash memory controller
Semiconductor Package Device with a Heat Dissipation Structure and the Packaging Method Thereof
Slicing level and sampling phase adaptation circuitry for data recovery systems
Semiconductor Package Device with Cavity Structure and the Packaging Method Thereof
Through-Silicon via Testing Structure
Method and Device for Multi-Channel Data Alignment in Transmission System
Hybrid Electronic Design System and Reconfigurable Connection Matrix Thereof
Abutment Structure of Semiconductor Cell
Method for Detecting the Under-Fill Void in Flip Chip Bga
Clock and Data Recovery System
Method for Packaging Semiconductor Device
Device for storing pulse latch with logic circuit
Abutment Structure of Semiconductor Cell
Related Assignments
(13)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 23, 2010
From: SUN, YU-MIN; CHENG, CHIH-FENG
To: GLOBAL UNICHIP CORPORATION
Reel/Frame 025454/0232 →
Assignment of Assignor's Interest
Dec 21, 2010
From: SU, ALAN PEISHENG
To: GLOBAL UNICHIP CORPORATION
Reel/Frame 025546/0318 →
Assignment of Assignor's Interest
Jan 11, 2011
From: TSAI, CHENG-MING; YEN, HENG-LIN; HUANG, LIAN-QUAN
To: GLOBAL UNICHIP CORPORATION
Reel/Frame 025670/0360 →
Assignment of Assignor's Interest
Feb 1, 2011
From: YEH, CHIA-FENG; WU, CHUNG-HWA; HUNG, SHAO-KANG
To: GLOBAL UNICHIP CORPORATION
Reel/Frame 025784/0650 →
Assignment of Assignor's Interest
Feb 1, 2011
From: ZU, LONGQIANG; LIN, YU-YU
To: GLOBAL UNICHIP CORPORATION
Reel/Frame 025782/0606 →
Assignment of Assignor's Interest
Feb 1, 2011
From: AN, FU-TAI; HSU, JEN-TAI
To: GLOBAL UNICHIP CORPORATION
Reel/Frame 025782/0603 →
Assignment of Assignor's Interest
Feb 23, 2011
From: CHANG, MING-TUNG; TSAI, MIN-HSIU
To: GLOBAL UNICHI CORPORATION
Reel/Frame 025886/0179 →
Assignment of Assignor's Interest
Feb 23, 2011
From: WU, SHIH-CHI; TSAI, MENG-CHIN; CHOU, TSUNG-PING
To: GLOBAL UNICHIP CORPORATION
Reel/Frame 025886/0295 →
Assignment of Assignor's Interest
Mar 9, 2011
From: CHEN, CHIEN-WEN; KAO, CHIA-JEN; CHUANG, JUI-CHENG
To: GLOBAL UNICHIP CORPORATION
Reel/Frame 025963/0652 →
Assignment of Assignor's Interest
Mar 9, 2011
From: CHEN, YI-FON; YANG, YU-CHENG; LEE, JYE-YUAN
To: GLOBAL UNICHIP CORPORATION
Reel/Frame 025963/0584 →
Assignment of Assignor's Interest
Mar 30, 2011
From: AN, FU-TAI; HSU, JEN-TAI; LEE, YI-LIN
To: GLOBAL UNICHIP CORPORATION
Reel/Frame 026123/0666 →
Assignment of Assignor's Interest
Apr 6, 2011
From: CHEN, CHIEN-WEN; ZU, LONGQIANG; TSAI, CHEN-FA
To: GLOBAL UNICHIP CORPORATION
Reel/Frame 026174/0287 →
Assignment of Assignor's Interest
Apr 20, 2011
From: YANG, YU-CHENG; HUNG, HSIN WEI; LI, HUNG-CHUN; LIAO, TENG-NAN
To: GLOBAL UNICHIP CORPORATION
Reel/Frame 026243/0768 →