IP Library › Granted Patent US 8,487,642
Granted Patent B2
US 8,487,642 · App. 12/926,507 · Granted Jul 16, 2013

Burn-in socket and testing fixture using the same

Inventors: Yu-Min Sun (Hsinchu, TW); Chih-Feng Cheng (Hsinchu, TW)
Assignee: Global Unichip Corporation
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,487,642
App. No.
12/926,507
Granted
Jul 16, 2013
Kind
B2
Abstract

A burn-in socket for carrying an electronic device to let the electronic device electrically connect to a circuit board via the burn-in socket is provided. The electronic device has a body and at least a lead. The burn-in socket comprises a frame and a carrier, the frame has an opening and a plurality of first aligning potions, wherein the opening fits onto the contour of the body, and the first aligning portions surrounds the opening. The carrier has a plurality of second aligning portions. The frame is assembled to the carrier with the conjunction of the first aligning portions and the second aligning portions. The body is capable of fitting into the opening to let the lead electrically connect to the circuit board via the carrier.

Claims (22)

1. A burn-in socket for carrying an electronic device to let said electronic device electrically connect to a circuit board having a body and at least a lead via said burn-in socket, said burn-in socket comprising:

a frame having an opening and a plurality of first aligning potions, wherein said opening fits onto said contour of said body, and said first aligning portions surround said opening; and

a carrier having a plurality of second aligning portions, the carrier comprising:

a bottom plate having a second hole;

a top plate having a first hole disposed on said bottom plate, said second aligning portions being disposed on said top plate, and said frame being assembled to said top plate with the conjunction of said first aligning portions and said second aligning portions; and

at least a contact element passing through the first hole and the second hole, the contact element protruding out of the top plate and the bottom plate, and said lead is electrically connected to said circuit board via said contact element; and

wherein said frame is assembled to said carrier with the conjunction of said first aligning portions and said second aligning portions, and said body is capable of fitting into said opening to let said lead electrically connect to said circuit board via said carrier.

2. The burn-in socket according to claim 1 , wherein said carrier further comprises a plurality of third aligning portions disposed on said bottom plate with corresponding locations to said second aligning portions.

3. The burn-in socket according to claim 1 , wherein said contact element comprises a metal particle, a metal spring, a conductive elastomer, a pogo pin and the combinations thereof.

4. The burn-in socket according to claim 1 further comprising a cover assembled to said frame and leant against said body to force said lead to electrically connect to said circuit board via said carrier.

5. A testing fixture for an electronic device having a body and at least a lead, said testing fixture comprising:

a circuit board; and

a burn-in socket comprising:

a frame having an opening and a plurality of first aligning potions, wherein said opening fits onto said contour of said body, and said first aligning portions surround said opening; and

a carrier having a plurality of second aligning portions, the carrier comprising:

a bottom plate having a second hole; and

a top plate having a first hole disposed on said bottom plate, said second aligning portions being disposed on said top plate, said frame being assembled to said top plate with the conjunction of said first aligning portions and said second aligning portions; and

at least a contact element passing through the first hole and the second hole so that the contact element protruding out of the top plate and the bottom plate, said lead is electrically connected to said circuit board via said contact element; and

wherein said frame is assembled to said carrier with the conjunction of said first aligning portions and said second aligning portions, and said body is capable of fitting into said opening to let said lead electrically connect to said circuit board via said carrier.

6. The testing fixture according to claim 5 , wherein said carrier further has a plurality of third aligning portions disposed on said bottom plate with corresponding locations to said second aligning portions.

7. The testing fixture according to claim 5 , wherein said contact element comprises a metal particle, a metal spring, a conductive elastomer, a pogo pin and the combinations thereof.

8. The testing fixture according to claim 5 , wherein said burn-in socket further comprises a cover assembled to said frame and leant against said body to force said lead to electrically connect to said circuit board via said carrier.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 12, 2016
From: GLOBAL UNICHIP CORPORATION
To: GLOBAL UNICHIP CORPORATION; TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
Reel/Frame 038555/0838 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 23, 2010
From: SUN, YU-MIN; CHENG, CHIH-FENG
To: GLOBAL UNICHIP CORPORATION
Reel/Frame 025454/0232 →
Priority Claims (1)
TW 99124848 A · Jul 28, 2010 · national
Continuity (1)
Related Publication 20120025860A1 · Feb 2, 2012