IP Library › Granted Patent US 9,299,683
Granted Patent B2
US 9,299,683 · App. 13/675,540 · Granted Mar 29, 2016

Abutment structure of semiconductor cell

Inventors: Yi-Fon Chen (Nantou County, TW); Yu-Cheng Yang (Kaohsiung, TW); Jye-Yuan Lee (Taipei, TW)
Assignee: GLOBAL UNICHIP CORPORATION
H01L25/00H01L27/0207H01L27/11807H01L2924/0002
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Quick Facts
Patent No.
US 9,299,683
App. No.
13/675,540
Granted
Mar 29, 2016
Kind
B2
Abstract

An abutment structure comprises a power rail, a ground rail parallel to the power rail, first cells and second cells. An area is defined between the power and the ground rails. A portion of each first and second cell overlaps the power and the ground rails, and another portion thereof is within the area. The first cells are within the abutment structure with original patterns thereof. The second cells respectively has an original pattern and a base pattern being a flip pattern of the original pattern, and are within the area with alternate of the original and the base patterns. The first and the second cells are within the area alternately without overlapping. Alternatively, the first and the second cells may also be within different areas, and the second cells are within different areas respectively with the base pattern and a flip pattern of the base pattern thereof.

Claims (10)

1. An abutment structure, comprising:

a plurality of power rails;

a plurality of ground rails, disposed parallel to said power rails and alternating with said power rails, wherein an area being defined between any one of said power rails and one of said ground rails adjacent thereto;

a plurality of first cells, a portion of each of said first cells overlapping one of said power rails and one of said ground rails adjacent thereto, and another portion thereof located within one of said areas located between one of said power rails and one of said ground rails overlapped by said another portion, wherein each of said first cells having an original pattern; and

a plurality of second cells, located within two of said areas adjacent to one of said areas disposed with said first cells, wherein each of said second cells having an original pattern, a base pattern being a flip pattern of said original pattern and a alternative pattern being a flip pattern of said base pattern, wherein some of said base patterns of said second cells being disposed to one of said areas that said second cells located within, and said alternative patterns of said second cells being disposed to the other one of said areas that said second cells located within.

2. The abutment structure as claimed in claim 1 , wherein a relationship between a location of any one of said first cells and locations of said second cells located within said areas adjacent to said first cell comprises translation.

3. The abutment structure as claimed in claim 2 , wherein a width of a gap between adjacent two of said first cells comprises equal to a width of said second cells.

4. The abutment structure as claimed in claim 1 , wherein a relationship between a location of any one of said first cells and locations of said second cells located within said areas adjacent to said first cell comprises center-alignment.

5. The abutment structure as claimed in claim 1 , wherein each of said base patterns of said second cells comprises formed from each of said original patterns of said second cells flipping about a flip axis parallel to a longitudinal direction of any one of said power rails.

6. The abutment structure as claimed in claim 1 , wherein each of said alternative patterns of said second cells comprises formed from each of said base patterns of said second cells flipping about a flip axis perpendicular to a longitudinal direction of any one of said power rails.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 12, 2016
From: GLOBAL UNICHIP CORPORATION
To: GLOBAL UNICHIP CORPORATION; TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
Reel/Frame 038555/0838 →
Priority Claims (1)
TW 99129032 A · Aug 30, 2010 · national
Continuity (2)
Continuation 13064160 · Mar 9, 2011
Related Publication 20130134484A1 · May 30, 2013