Patent Assignment
Reel/Frame 025784/0650
Assignment of Assignor's Interest
Recorded: 2011-02-01
Pages: 3
Assignors
YEH, CHIA-FENG
Executed: 2011-01-24
WU, CHUNG-HWA
Executed: 2011-01-24
HUNG, SHAO-KANG
Executed: 2011-01-24
Assignee
GLOBAL UNICHIP CORPORATION
NO. 10, LI-HSIN 6TH RD., HSINCHU, SCIENCE PARK, HSINCHU CITY 300, ROC, TAIWAN
Covered Property
(1)
Semiconductor Package Device with a Heat Dissipation Structure and the Packaging Method Thereof
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.