IP Library › Granted Patent US 8,310,302
Granted Patent B2
US 8,310,302 · App. 13/064,160 · Granted Nov 13, 2012

Abutment structure of semiconductor cell

Assignee: Global Unichip Corporation
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Quick Facts
Patent No.
US 8,310,302
App. No.
13/064,160
Granted
Nov 13, 2012
Kind
B2
Abstract

An abutment structure comprises a power rail, a ground rail parallel to the power rail, first cells and second cells. An area is defined between the power and the ground rails. A portion of each first and second cell overlaps the power and the ground rails, and another portion thereof is within the area. The first cells are within the abutment structure with original patterns thereof. The second cells respectively has an original pattern and a base pattern being a flip pattern of the original pattern, and are within the area with alternate of the original and the base patterns. The first and the second cells are within the area alternately without overlapping. Alternatively, the first and the second cells may also be within different areas, and the second cells are within different areas respectively with the base pattern and a flip pattern of the base pattern thereof.

Claims (6)

1. An abutment structure, comprising:

a power rail;

a ground rail, disposed parallel to said power rail, wherein an area defined between said power rail and said ground rail;

a plurality of first cells, a portion of each of said first cells overlapping said power rail and said ground rail, and another portion of each of said first cells being located within said area, wherein each of said first cells having an original pattern; and

a plurality of second cells, a portion of each of said second cells overlapping said power rail and said ground rail, and another portion of each of said second cells being located within said area, wherein each of said second cells having an original pattern and a base pattern, and said base pattern being a flip pattern of said original pattern, wherein said first cells and said second cells being disposed within said area alternately without overlapping, said first cells being disposed within said area with said original patterns of said first cells, and said second cells being disposed within said area with alternate of said original and said base patterns of said second cells.

2. The abutment structure according to claimed in claim 1 , wherein each of said base patterns of said second cells comprises formed from each of said original patterns of said second cells flipping about a flip axis perpendicular to a longitudinal direction of said power rail.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 12, 2016
From: GLOBAL UNICHIP CORPORATION
To: GLOBAL UNICHIP CORPORATION; TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
Reel/Frame 038555/0838 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 9, 2011
From: CHEN, YI-FON; YANG, YU-CHENG; LEE, JYE-YUAN
To: GLOBAL UNICHIP CORPORATION
Reel/Frame 025963/0584 →
Priority Claims (1)
TW 99129032 A · Aug 30, 2010 · national
Continuity (1)
Related Publication 20120049948A1 · Mar 1, 2012